| Title: | Assessment of the reliability of solder joints to ball and column grid array packages for space applications |
| Authors: | P.- E. Tegehall ; B. D. Dunn ; European Space Agency. |
| Material Type: | report |
| Publisher: | [S.l.] : ESA Publications Division, 2001 |
| Series: | ESA STM |
| ISBN / ISSN / EAN : | 978-92-9092-358-9 |
| Format: | iv, 57 p. / ill. (some col.) / 30 cm |
| Bibliography note: | Includes bibliographical references. |
| Languages: | English |
| Class number: | TK7870.16 |
| Subjects: | Ball grid array technology |
| Permalink: | https://isulibrary.isunet.edu/index.php?lvl=notice_display&id=4542 |
Holdings (1)
| Barcode | Call number | Section | Status | Donated by | Digital bookplate |
|---|---|---|---|---|---|
| 009094 | ESA STM ; 266 2001 | Periodical section | Available | ESA |
